智能热交换器控制器软件设计

论文编号:ZD1033    论文字数:10139,页数:43

摘  要
 热交换器的工作原理为依靠新风和排风的温差和蒸汽分压力差通过全热交换用纸来达到热湿交换，回收排风的能量对新风进行夏季预冷除湿、冬季预热加湿，从而达到节能的目的，与其他能量回收装置相比的最大优点是新风和排风不会发生交叉污染，结构紧凑，压力损失小。
 本次毕业设计包括温度控制模块和显示模块，其中温度控制模块主要通过Microchip公司生产的PIC芯片对外接设备如加热器、热交换器和空调的通断控制来维持基站内的环境温度；显示模块是通过两片三位的数码管、五个运行灯及一个报警灯来显示工作状态和室内外温度等参数的。程序由PIC汇编语言实现，并使用MAPLAB IDE编译器进行程序的编译。最终进行与硬件和上位机相连，进行调试。

关键词：PIC单片机、热交换器、温度控制
 Abstract
The working principle of heat exchanger is:rely on the fresh air and exhaust air temperature and vapor pressure difference,achieve the exchange of heat and moisture through heat exchange, recover exhaust energy, precooling and dehumidify in summer and preheating and humidify in winter to fresh air, so as to achieve the purpose of energy saving. Compared with other energy recovery units, the biggest advantage is:fresh air and exhaust cross-contamination don't occur cross contamination, compact structure, and small pressure loss.
The graduation design includes: Temperature control module and display module. Thereinto, temperature control module mainly maintenance ambient temperature within base station through PIC chip producted by Microchip controls the external devices on-off,such as heaters, heat exchangers and air-conditioning. Display module show the work state, the in/out temperature and other parameters through 2 digital control of three, five runs and a warning lamp lights. Procedure is carried out by PIC assembly language, then is complied by using MAPLAB IDE compiler. Eventually connect the hardware and host computer and debug.
Keywords：PICmicro-control unit,Heat exchangers, temperature control

目  录
摘  要 I
Abstract II
1  前 言 1
1.1  选题背景 1
1.2  选题意义 1
1.3  主要研究内容 1
2  总体方案设计 2
2.1  系统设计要求 2
2.2  系统设计分工 3
2.3  系统硬件结构 3
2.4  系统总体软件流程 4
3  PIC单片机简介 5
3.1  PIC16F77单片机 5
3.1.1  单片机引脚 5
3.2  特殊功能寄存器 7
3.2.1  状态寄存器STATUS 7
3.2.2  选项寄存器OPTION_REG 8
4  PIC指令与汇编语言 10
4.1  PIC指令系统 10
4.1.1  数据传送类指令 10
4.1.2  算术运算类指令 11
4.1.3  逻辑运算类指令 11
4.1.4  控制转移类指令 12
4.2  汇编语言 13
5  系统软件设计 14
5.1  显示模块 14
5.1.1  键盘扫描 14
5.2  温度控制模块 20
5.2.1  目标温度控制 21
5.2.2  A/D转换 22
5.3  调速模块 25
5.3.1  PWM技术简述 26
5.3.2  PWM调速 26
6  MAPLAB的使用与调试 28
6.1  MAPLAB简介 28
6.2  MAPLAB使用 28
6.2.1  MAPLAB编译 28
6.2.2  编译错误 29
6.3  硬件调试 30
7  总  结 31
致 谢 32
参考文献 33
附录1  系统单片机程序 34

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