基于MAX9995的芯片简介及应用电路设计

字数:4968.页数:19

摘 要

MAX9995双路、高线性度、下变频混频器能够为UMTS/WCDMA、DCS和PCS基站应用提供6.1dB增益、+25.6dBm的IIP3和9.8dB的NF。MAX9995适合于低端LO注入。
该器件在RF和LO端口集成了平衡非平衡转换器、双输入LO可选开关、LO缓冲器、两个双平衡混频器和一对差分IF输出放大器。MAX9995需要典型值为0dBm的LO驱动，确保电源电流低于380mA。
这些器件采用紧凑的36引脚薄型QFN封装(6mm x 6mm)，具有裸露焊盘。其电特性保证在TC = -40°C到+85°C的扩展温度范围内有效

Abstract：The MAX9995 dual, high-linearity, downconversion mixer provides 6.1dB gain, +25.6dBm IIP3, and 9.8dB NF for UMTS/WCDMA, DCS, and PCS base-station applications. The MAX9995 is ideal for low-side LO injection.
This device integrates baluns in the RF and LO ports, a dual-input LO selectable switch, an LO buffer, two doublebalanced mixers, and a pair of differential IF output amplifiers.The MAX9995 requires a typical LO drive of 0dBm and supply current is guaranteed to be below 380mA.
These devices are available in a compact 36-pin thin QFN package (6mm   6mm) with an exposed paddle.Electrical performance is guaranteed over the extended temperature range, from TC = -40°C to +85°C.

关键词：    MAX9995   增益   裸露焊盘  驱动     电气特性    封装 

Keywords:    MAX9995           GAIN    EXPOSED PADDLE
 DRIVE     ELECTRICAL CHARACTERISTICS      PACKAGE

目    录
1、摘要 ..........................................................................3
2、芯片简介.......................................................................4
3、主要特性.......................................................................4
4、MAX9995应用 ...................................................................4
5、内部结构 ......................................................................5
6、MAX9995电气特性 ...............................................................6
6.1  MAX9995直流电气特性..........................................................6
6.2  MAX9995交流电气特性..........................................................6
7、典型工作特性 ..................................................................8
8、引脚功能 .....................................................................12
9、详细说明 .....................................................................13
10、应用电路 ....................................................................14
      10.1 应用电路^论文  ........................................................14
    10.2 应用电路图..............................................................15
10.3 应用电路零件参数表..........................................................15
11、封装^论文 ....................................................................16
12、结论  .......................................................................19
13、参考文献 ....................................................................19

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