论文编号:CL008 本论文字数:20114,页数:40 摘 要 Study on the Curing System of RTV Silicone Gel Electronic Encapsulation Materials Abstract: Silicone gel will excellent resistance of water, mould proof and salt fog. It can increase reliability of electronic devices under severe circumstances when the electronic devices were poured with. 目 录
|
| |
上一篇:木粉含量对PVC/木粉复合材料性能.. | 下一篇:棉籽蛋白接枝丙烯酸高吸水性树脂.. |
推荐论文 | 本专业最新论文 |
Tags:有机硅 电子 材料 交联 体系 研究 | 2010-01-25 12:29:25【返回顶部】 |